Please use this identifier to cite or link to this item: https://hdl.handle.net/20.500.11851/11752
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dc.contributor.authorÇakır, Deniz-
dc.contributor.authorCaylan, Omer R.-
dc.contributor.authorGurpinar, Erhan-
dc.contributor.authorAkgul, Ogulcan-
dc.contributor.authorTuğrul, H. Onat-
dc.contributor.authorOkay, Elif-
dc.contributor.authorAtli, Eren-
dc.date.accessioned2024-09-22T13:30:26Z-
dc.date.available2024-09-22T13:30:26Z-
dc.date.issued2024-
dc.identifier.issn2631-6331-
dc.identifier.urihttps://doi.org/10.1088/2631-6331/ad6954-
dc.identifier.urihttps://hdl.handle.net/20.500.11851/11752-
dc.description.abstractThis study explores the compressive mechanical properties of copper composites reinforced with graphene. Graphene was synthesized on copper powders via plasma-enhanced chemical vapor deposition. Multilayer graphene formation has been substantiated by Raman analysis. Graphene-coated copper (G/Cu) powders were then subjected to pressing and sintering to fabricate G/Cu composites. The mechanical properties of G/Cu composites were investigated under compression from room temperature up to 400 degrees C in air. The results demonstrated a substantial improvement in the mechanical properties of G/Cu composites compared to monolithic copper. Specifically, the yield strength in compression of the G/Cu composite increased by 203% at room temperature and by 190% at 200 degrees C. At 400 degrees C, the yield strength enhancement exceeded 370%. Microstructural analysis suggests that the observed enhancements in G/Cu composites can be attributed to reduced porosity, smaller grain size, and inhibited dislocation motion at the increased grain boundary area (due to refined grain size) and graphene-copper interfaces.en_US
dc.description.sponsorshipScientific and Technological Research Council of Turkey (TUBITAK) [118F491]en_US
dc.description.sponsorshipThe authors extend their gratitude to Professor Dr Omer Tarik Ogurtani (Middle East Technical University) for his invaluable comments. Additionally, & Idot;kra Ucar, Ali Deniz K & imath;rdoek, and Nevzat Duman are acknowledged for their assistance with metallographic sample preparation. This work was supported by the Scientific and Technological Research Council of Turkey (TUBITAK) under Grant Number 118F491.en_US
dc.language.isoenen_US
dc.publisherIop Publishing Ltden_US
dc.relation.ispartofFunctional Composites and Structuresen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectgrapheneen_US
dc.subjectplasma enhanced CVDen_US
dc.subjectcopperen_US
dc.subjectcompositeen_US
dc.subjectcompression testen_US
dc.subjectmechanical propertiesen_US
dc.subjectMechanical-Propertiesen_US
dc.subjectThermal-Conductivityen_US
dc.subjectHigh-Temperatureen_US
dc.subjectTensileen_US
dc.titleEnhanced Compressive Strength of Graphene Strengthened Copper (g/Cu) Compositesen_US
dc.typeArticleen_US
dc.departmentTOBB ETÜen_US
dc.identifier.volume6en_US
dc.identifier.issue3en_US
dc.authoridCAYLAN, OMER REFET/0000-0001-5352-0112-
dc.identifier.wosWOS:001290623900001en_US
dc.identifier.scopus2-s2.0-85201319037en_US
dc.institutionauthor-
dc.identifier.doi10.1088/2631-6331/ad6954-
dc.authorwosidAkgul, Ogulcan/HGC-3417-2022-
dc.authorwosidKockar, Benat/H-5630-2013-
dc.authorscopusid15749936200-
dc.authorscopusid57217485587-
dc.authorscopusid59260612800-
dc.authorscopusid57219055774-
dc.authorscopusid56703249700-
dc.authorscopusid59260612900-
dc.authorscopusid59260795100-
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
item.openairetypeArticle-
item.languageiso639-1en-
item.grantfulltextnone-
item.fulltextNo Fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.cerifentitytypePublications-
Appears in Collections:Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection
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