Modeling of Thin Films and Cover Plates Bonded To Graded Substrates

Abstract

In this study the contact problems for thin films and cover plates will be considered. In these problems the loading consists of any one or combination of stresses caused by uniform temperature changes and temperature excursions, far field mechanical loading, and residual stresses resulting from film processing or welding. The primary interest in this study is in examining stress concentrations or singularities near the film ends for the purpose of addressing the question of crack initiation and propagation in the substrate or along the interface. The underlying contact mechanics problem is formulated and solved analytically by reducing it to an integral equation.