Please use this identifier to cite or link to this item: https://hdl.handle.net/20.500.11851/7032
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dc.contributor.authorGüler, Mehmet Ali-
dc.date.accessioned2021-09-11T15:45:02Z-
dc.date.available2021-09-11T15:45:02Z-
dc.date.issued2008en_US
dc.identifier.issn0021-8936-
dc.identifier.issn1528-9036-
dc.identifier.urihttps://doi.org/10.1115/1.2936237-
dc.identifier.urihttps://hdl.handle.net/20.500.11851/7032-
dc.description.abstractIn this study, the contact problems of thin films and cover plates are considered. In these problems, the loading consists of any one or combination of stresses caused by uniform temperature changes and temperature excursions, far field mechanical loading, and residual stresses resulting from film processing or welding. The primary interest in this study is in examining stress concentrations or singularities near the film ends for the purpose of addressing the question of crack initiation and propagation in the substrate or along the interface. The underlying contact mechanics problem is formulated by assuming that the film is a "membrane" and the substrate a graded elastic continuum, and is solved analytically by reducing it to an integral equation. The calculated results are the interfacial shear stress between the film and the graded substrate, the Mode II stress intensity factor at the end of the film, and the axial normal stress in the film. The results indicate that grading the material properties of the substrate helps to decrease the film stresses and the stress intensity factors at the free edges and to lower the axial normal stresses at the midsection where the film is most likely to crack.en_US
dc.description.sponsorshipTUBITAKTurkiye Bilimsel ve Teknolojik Arastirma Kurumu (TUBITAK) [MAG-107M053]en_US
dc.description.sponsorshipThis study was supported by the Scientific and Technical Research Council of Turkey (TUBITAK) under Research Grant No. MAG-107M053. The author is grateful to Dr. F. Erdogan and Dr. S. Dag for helpful discussions during the formulation phase of this work.en_US
dc.language.isoenen_US
dc.publisherAsmeen_US
dc.relation.ispartofJournal of Applied Mechanics-Transactions of The Asmeen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectthin filmen_US
dc.subjectcontact stressen_US
dc.subjectfunctionally graded materialen_US
dc.subjectcover plateen_US
dc.subjectstress intensity factoren_US
dc.titleMechanical modeling of thin films and cover plates bonded to graded substratesen_US
dc.typeArticleen_US
dc.departmentFaculties, Faculty of Engineering, Department of Mechanical Engineeringen_US
dc.departmentFakülteler, Mühendislik Fakültesi, Makine Mühendisliği Bölümütr_TR
dc.identifier.volume75en_US
dc.identifier.issue5en_US
dc.authorid0000-0002-1159-556X-
dc.authorid0000-0002-1159-556X-
dc.identifier.wosWOS:000257895100017en_US
dc.identifier.scopus2-s2.0-52649179955en_US
dc.institutionauthorGüler, Mehmet Ali-
dc.identifier.doi10.1115/1.2936237-
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.identifier.scopusqualityQ1-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.grantfulltextnone-
item.fulltextNo Fulltext-
item.openairetypeArticle-
item.cerifentitytypePublications-
item.languageiso639-1en-
crisitem.author.dept02.7. Department of Mechanical Engineering-
Appears in Collections:Makine Mühendisliği Bölümü / Department of Mechanical Engineering
Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection
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