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Title: Refueling: Preventing wire degradation due to electromigration
Authors: Abella, Jaume
Vera, Xavier
Ünsal, Osman S.
Ergin, Oğuz
Gonzalez, Antonio
Tschanz, James W.
Kartal, Yavuz Selim
Keywords: FAILURE
Issue Date: 2008
Publisher: IEEE MICRO
Abstract: Electromigration is a major source of wire and via failure. Refueling undoes em for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits em's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.
ISSN: 0272-1732
Appears in Collections:Bilgisayar Mühendisliği Bölümü / Department of Computer Engineering
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection

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