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|Title:||Refueling: Preventing wire degradation due to electromigration||Authors:||Abella, Jaume
Ünsal, Osman S.
Tschanz, James W.
Kartal, Yavuz Selim
|Keywords:||FAILURE||Issue Date:||2008||Publisher:||IEEE MICRO||Abstract:||Electromigration is a major source of wire and via failure. Refueling undoes em for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits em's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.||URI:||https://doi.org/10.1109/MM.2008.92
|Appears in Collections:||Bilgisayar Mühendisliği Bölümü / Department of Computer Engineering|
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection
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