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|Title:||Mic-in-CMOS: CMUT as a Sealed-Gap Capacitive Microphone||Authors:||Köymen, H.
Taşdelen, A. S.
|Issue Date:||Sep-2020||Publisher:||IEEE Computer Society||Source:||Koymen, H., Ahiska, Y., Atalar, A., Köymen, I., Tasdelen, A. S., and Yilmaz, M. (2020, September). Mic-in-CMOS: CMUT as a Sealed-Gap Capacitive Microphone. In 2020 IEEE International Ultrasonics Symposium (IUS) (pp. 1-4). IEEE.||Abstract:||The design and production of a CMOS compatible, watertight and ingress-proof CMUT (capacitive micromachined ultrasonic transducer) microphone, mic-in-CMOS, with vacuum-gap is described. We present an analytical model-based approach for the design of mic-in-CMOS, where a basis for quantitative comparison of performance trade-offs is provided. The sealed vacuum gap of the mic-in-CMOS is basically a lossless sensor, free of mechanical noise. Its SNR is determined by the noise of the pre-amplification electronics (the noise contributor in a CMUT with vacuum gap is essentially the radiation resistance, which is less than 0 dBA for audio band for a 1 mm2 device). The design of mic-in-CMOS involves many multilateral trade-offs such as gap height vs membrane thickness vs sensitivity vs need for linear operation vs bias voltage and atmospheric depression, to name few. The mic-in-CMOS design can be mass produced using CMOS film stacks only, as such the fabrication process can be carried out entirely in a CMOS processes production line complemented with CMOS compatible post-processing approaches. Mic-in-CMOS has the advantage of low production cost with minimal packaging requirement and on-die EMI / EMC. © 2020 IEEE.||URI:||https://hdl.handle.net/20.500.11851/4061
|Appears in Collections:||Elektrik ve Elektronik Mühendisliği Bölümü / Department of Electrical & Electronics Engineering|
Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection
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