Please use this identifier to cite or link to this item:
Title: Modeling of thin films and cover plates bonded to graded substrates
Authors: Güler, Mehmet Ali
Erdogan, Fazıl
Dağ, Serkan
Keywords: contact mechanics
thin films
functionally graded materials
Issue Date: 2008
Publisher: Amer Inst Physics
Source: 9th International Conference on Multiscale and Functionally Graded Materials -- OCT 15-18, 2006 -- Oahu, HI
Series/Report no.: AIP Conference Proceedings
Abstract: In this study the contact problems for thin films and cover plates will be considered. In these problems the loading consists of any one or combination of stresses caused by uniform temperature changes and temperature excursions, far field mechanical loading, and residual stresses resulting from film processing or welding. The primary interest in this study is in examining stress concentrations or singularities near the film ends for the purpose of addressing the question of crack initiation and propagation in the substrate or along the interface. The underlying contact mechanics problem is formulated and solved analytically by reducing it to an integral equation.
ISBN: 978-0-7354-0492-2
ISSN: 0094-243X
Appears in Collections:Makine Mühendisliği Bölümü / Department of Mechanical Engineering
Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection

Show full item record

CORE Recommender

Page view(s)

checked on Dec 26, 2022

Google ScholarTM



Items in GCRIS Repository are protected by copyright, with all rights reserved, unless otherwise indicated.