Please use this identifier to cite or link to this item: https://hdl.handle.net/20.500.11851/8959
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dc.contributor.authorGunes, Hasan A.-
dc.contributor.authorKurt, Hamza-
dc.contributor.authorUnlu, Mehmet-
dc.date.accessioned2022-11-30T19:24:51Z-
dc.date.available2022-11-30T19:24:51Z-
dc.date.issued2022-
dc.identifier.isbn978-1-5106-5173-9-
dc.identifier.isbn978-1-5106-5172-2-
dc.identifier.issn0277-786X-
dc.identifier.issn1996-756X-
dc.identifier.urihttps://doi.org/10.1117/12.2622038-
dc.identifier.urihttps://hdl.handle.net/20.500.11851/8959-
dc.descriptionConference on Integrated Photonics Platforms II -- APR 03-MAY 20, 2022 -- ELECTR NETWORKen_US
dc.description.abstractA waveguide-to-substrate, vertical bend coupler that is based on genetic algorithm is introduced to couple and direct the optical flow in 3D photonic integrated circuits. The vertical coupler device enables high-efficiency broadband optical transmission between different dielectric layers over comparable distances to the coupler's length. The vertical coupler attains an adept transition between a silicon waveguide and a planar Si layer separated by a SiO2 spacer. The simulation results of the designed vertical coupler device show a coupling ratio of -3.4 dB at 1550 nm wavelength and at 1 mu m vertical transition depth, thanks to the effective manipulation of light. The coupler possesses a miniscule area of 2 mu m x 2 mu m compared to its conventional counterparts. Our proposed waveguide-to-substrate coupler represents an unprecedented, elevated solution with high- efficiency and broadband operation for the vertical transition in 3D photonic integrated circuits. It can take an important part in overcoming the obstacles on the way of 3D photonic integrated circuits for virtual reality and quantum computing applications.en_US
dc.description.sponsorshipSPIE,IdEx Univ Strasbourg,CNRS,ICube,Univ Strasbourgen_US
dc.description.sponsorshipScientific and Technical Research Council (TUBITAK) [2210A]; TUBITAK [119E501]en_US
dc.description.sponsorshipH.A.G. acknowledges the partial support from the Scientific and Technical Research Council (TUBITAK) 2210A Grant. This project is supported by TUBITAK under grant 119E501.en_US
dc.language.isoenen_US
dc.publisherSpie-Int Soc Optical Engineeringen_US
dc.relation.ispartofIntegrated Photonics Platforms Iien_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectVertical coupleren_US
dc.subjectphotonic integrated circuitsen_US
dc.subject3D on-chip circuitsen_US
dc.subjectgenetic algorithmen_US
dc.subjectsilicon on insulatoren_US
dc.titleWaveguide-to-Substrate Vertical Bend Coupler Design for 3D Photonic Integrated Circuitsen_US
dc.typeConference Objecten_US
dc.identifier.volume12148en_US
dc.identifier.wosWOS:000838086300019en_US
dc.identifier.scopus2-s2.0-85133125530en_US
dc.identifier.doi10.1117/12.2622038-
dc.authorscopusid57219229498-
dc.authorscopusid57189350201-
dc.authorscopusid57192393118-
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.identifier.scopusquality--
dc.ozel2022v3_Editen_US
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.grantfulltextnone-
item.fulltextNo Fulltext-
item.openairetypeConference Object-
item.cerifentitytypePublications-
item.languageiso639-1en-
crisitem.author.dept02.5. Department of Electrical and Electronics Engineering-
Appears in Collections:Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
WoS İndeksli Yayınlar Koleksiyonu / WoS Indexed Publications Collection
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